Give your final-year students a semiconductor credential and an internship pathway.
IEEE-IDSPS 2026 brings 12 in-person courses on chip packaging, power electronics, thermal design and test to Visakhapatnam on December 6. Students earn a certificate of participation, and top performers may be considered for internships. Groups of 10 or more pay 40% less through Cemetrix.
- When
- Sunday, December 6, 2026, 9:00 AM to 6:15 PM
- Where
- Novotel Visakhapatnam, Beach Road
- Format
- 3 tracks, four 2-hour courses in each
- Deadline
- Thursday, December 3
Request received
Thanks. The Cemetrix team will call you on your WhatsApp number.
Questions now? Call or WhatsApp +91 63811 94585.
How it works
You share a list; we take care of every registration.
Request
Tell us how many students and from which departments.
We register them
Share the student list. We register everyone with IEEE-IDSPS and send one confirmation.
Students attend and get certified
Students attend on December 6, receive certificates, and top performers may be considered for internships.
Pricing
The IEEE-IDSPS website gives 20% off. Registering through Cemetrix starts at 25% off, and groups save up to 40%.
| Per person | IEEE-IDSPS website (20% off) | Cemetrix, 1 to 4 people (25% off) | Cemetrix, group of 5+ (30% off) | Cemetrix, group of 10+ (40% off) |
|---|---|---|---|---|
| Student | ₹3,000 | ₹2,800 | ₹2,400 | |
| Accompanying faculty | ₹4,500 | ₹4,200 | ₹3,600 |
Group rates apply to students and faculty from the same institution registered together.
The courses
Students choose one of three rooms based on their branch. Each runs four 2-hour courses taught by international experts.
| Time | Room 1Design | Room 2Materials and substrates | Room 3Assembly, test, thermal and power |
|---|---|---|---|
| 9:00 to 11:00 AM | What is packaging? Why advanced packaging is importantProf. Madhavan Swaminathan, Penn State, USA | Advanced package substrates: ceramic, organic and glassDr. Venky Sundaram and Dr. Habib Hichri | IC assembly: wire bond, flip chip, TCB and hybrid bondingVikas Gupta, ASE, USA |
| 11:00 to 11:15 AM: tea and coffee | |||
| 11:15 AM to 1:15 PM | Package design and architecturesDr. Arun Chandrashekar, Intel, India | 2.5D interposers and RDLDr. Habib Hichri and Dr. Venky Sundaram | Power electronicsProf. Alan Mantooth, University of Arkansas, USA |
| 1:15 to 2:00 PM: lunch | |||
| 2:00 to 4:00 PM | Design for reliabilityProf. Abhijit Dasgupta, University of Maryland, USA | Packaging materials for power componentsProf. Raj Pulugurtha, Florida International University, USA | Thermal management of logic and power devicesProf. Yogendra Joshi, Georgia Tech, USA |
| 4:00 to 4:15 PM: tea and coffee | |||
| 4:15 to 6:15 PM | Power module designDr. Devan Iyer, GEA, USA | Opto-electronicsDr. Ravi Mahajan, Intel, USA | Electrical testProf. Abhijit Chatterjee, Georgia Tech, USA |
Why placement cells send students
Semiconductor and electronics hiring is growing in India. This gives your students something specific to show for it.
A recognised certificate
Certificate of participation from an IEEE conference programme.
Internship consideration
Top performers may be considered for internships, subject to eligibility.
Interview talking points
Hands-on vocabulary in packaging, power, thermal and test, from the people who do the work.
Ongoing support
Cemetrix offers training for final-year students, with internship and placement support subject to assessment.
Teaching on December 6: Intel, ASE, GEA, Ajinomoto Fine-Techno, Penn State, Georgia Tech, University of Maryland, University of Arkansas and Florida International University.
Questions
How much does it cost per student?
₹2,400 each in a group of 10 or more, ₹2,800 in a group of 5 to 9, and ₹3,000 individually. On the IEEE-IDSPS website it's ₹3,200.
Are internships or placements guaranteed?
No. Top performers may be considered for internships, based on eligibility, assessment and availability.
Which students should attend?
ECE, EEE, Mechanical, Physics and Materials students get the most from it. Final-year students benefit most for placements.
What's the deadline?
Send your request by Thursday, December 3. Earlier is better, since each room has limited seats.
Each room has limited seats. Request early.
Request group registration