Bring the latest in advanced packaging back to your classroom and lab.
Spend December 6 learning chip packaging, 2.5D/3D integration, power modules, thermal design and electrical test from Intel, Georgia Tech, Penn State and the University of Maryland. Register through Cemetrix for 25% off, and up to 40% off when you come with colleagues or students.
- When
- Sunday, December 6, 2026, 9:00 AM to 6:15 PM
- Where
- Novotel Visakhapatnam, Beach Road
- Format
- 3 tracks, four 2-hour courses in each
- Deadline
- Thursday, December 3
Interest registered
Thanks. The Cemetrix team will call you on your WhatsApp number.
Questions now? Call or WhatsApp +91 63811 94585.
How it works
You tell us what you need, and we handle the registration with IEEE-IDSPS.
Register interest
Tell us your track and whether colleagues or students will join you.
Talk to us
We confirm the fee, your group rate and how to pay.
Attend
Join the courses on December 6 and collect your certificate.
Pricing
The IEEE-IDSPS website gives 20% off. Registering through Cemetrix starts at 25% off, and groups save up to 40%.
| Per person | IEEE-IDSPS website (20% off) | Cemetrix, 1 to 4 people (25% off) | Cemetrix, group of 5+ (30% off) | Cemetrix, group of 10+ (40% off) |
|---|---|---|---|---|
| Faculty or researcher | ₹4,500 | ₹4,200 | ₹3,600 | |
| Student you bring | ₹3,000 | ₹2,800 | ₹2,400 |
Group rates apply to participants from the same institution registered together, so faculty and students from one college can make up a group.
The courses
Choose one room for the day. Each runs four 2-hour courses, taught by the researchers and engineers driving advanced packaging.
| Time | Room 1Design | Room 2Materials and substrates | Room 3Assembly, test, thermal and power |
|---|---|---|---|
| 9:00 to 11:00 AM | What is packaging? Why advanced packaging is importantProf. Madhavan Swaminathan, Penn State, USA | Advanced package substrates: ceramic, organic and glassDr. Venky Sundaram and Dr. Habib Hichri | IC assembly: wire bond, flip chip, TCB and hybrid bondingVikas Gupta, ASE, USA |
| 11:00 to 11:15 AM: tea and coffee | |||
| 11:15 AM to 1:15 PM | Package design and architecturesDr. Arun Chandrashekar, Intel, India | 2.5D interposers and RDLDr. Habib Hichri and Dr. Venky Sundaram | Power electronicsProf. Alan Mantooth, University of Arkansas, USA |
| 1:15 to 2:00 PM: lunch | |||
| 2:00 to 4:00 PM | Design for reliabilityProf. Abhijit Dasgupta, University of Maryland, USA | Packaging materials for power componentsProf. Raj Pulugurtha, Florida International University, USA | Thermal management of logic and power devicesProf. Yogendra Joshi, Georgia Tech, USA |
| 4:00 to 4:15 PM: tea and coffee | |||
| 4:15 to 6:15 PM | Power module designDr. Devan Iyer, GEA, USA | Opto-electronicsDr. Ravi Mahajan, Intel, USA | Electrical testProf. Abhijit Chatterjee, Georgia Tech, USA |
Why faculty attend
For faculty, researchers and PhD scholars in electronics, electrical, mechanical, physics and materials.
Current material
Topics from packaging fundamentals to glass substrates, power modules and electrical test.
Research contacts
Meet speakers from Intel, ASE, GEA and leading US universities in one room.
Certificate
A certificate of participation for the courses you attend.
Lower rates for your students
Bring 10 or more and everyone pays 40% less than the list price.
Teaching on December 6: Intel, ASE, GEA, Ajinomoto Fine-Techno, Penn State, Georgia Tech, University of Maryland, University of Arkansas and Florida International University.
Questions
How much does it cost?
₹4,500 per faculty member through Cemetrix, compared with ₹4,800 on the IEEE-IDSPS website. Groups of 5 or more pay ₹4,200 each, and groups of 10 or more pay ₹3,600 each.
Can I bring students?
Yes. Students pay ₹3,000 each, or as little as ₹2,400 in a group of 10 or more. Tell us in the form and we'll register everyone together.
Is registering interest the same as registering?
No. Your seat is confirmed only after we speak with you and your registration is complete.
When is the last date?
Register interest by Thursday, December 3, so we can confirm your seat before December 6.
Seats in each room are limited.
Register interest